Stanford-Led Team Presents First Monolithic 3D AI Chip Built in U.S. Foundry at IEDM

Summary

A collaborative team from Stanford University, Carnegie Mellon University, the University of Pennsylvania, and MIT presented the first monolithic 3D chip built in a U.S. foundry at the IEEE International Electron Devices Meeting (IEDM 2025), which ran December 6-10, 2025, in San Francisco. The chip was fabricated at SkyWater Technology's foundry in Bloomington, Minnesota, making it the first such chip manufactured domestically. Unlike traditional 3D chip stacking that fabricates separate chips