SK hynix Debuts 16-Layer 48GB HBM4 AI Memory at CES 2026

Summary

SK hynix showcased its next-generation AI memory solutions at CES 2026, debuting a 16-layer HBM4 chip with 48GB capacity for the first time. This is the successor to its 12-layer HBM4 with 36GB, which achieved the industry's fastest speed of 11.7 Gbps. The 16-layer variant is currently under development aligned with customer schedules and represents the cutting edge of high-bandwidth memory needed to power next-generation AI accelerators including NVIDIA's Vera Rubin platform. The company also